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CAP200DG Datasheet(PDF) 4 Page - Power Integrations, Inc. |
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CAP200DG Datasheet(HTML) 4 Page - Power Integrations, Inc. |
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4 / 8 page ![]() Rev. C 11/18 4 CAP200DG www.power.com Notes A. Saturation current specifications ensure a natural RC discharge characteristic at all voltages up to 265 VAC peak with the external resistor values specified in Component Selection Table 1. B. Specifications are guaranteed by characterization and design. Absolute Maximum Ratings(4) DRAIN Pin Voltage(1) ............................................................1000 V DRAIN Peak Current(2) .......................................................5.333 mA Storage Temperature ..............................................-65 °C to 150 °C Lead Temperature(3) ..............................................................260 °C Operating Ambient Temperature.............................. -10 °C to 105 °C Maximum Junction Temperature .............................. -10 °C to 110 °C Notes: 1. Voltage of D1 pin relative to D2 pin in either polarity. 2. The peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 3. 1/16 in. from case for 5 seconds. 4. The Absolute Maximum Ratings specified may be applied one at a time without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability. Parameter Symbol Conditions T A = -10 to 105 °C (Unless Otherwise Specified) Min Typ Max Units Control Functions AC Removal Detection Time t DETECT Line Cycle Frequency 47-63 Hz 22 31.4 ms Drain Saturation CurrentA,B I DSAT CAP200DG 2.5 mA Supply Current I SUPPLY T A = 25 °C 21.7 mA Thermal Resistance Thermal Resistance: D Package(1): (q JA).................160 °C/W (Single layer JEDEC PCB) (q JC).......................................... 40 °C/W (Bottom) (q JC)............................................... 75 °C/W (Top) Notes: 1. Reference thermal resistance test conditions: JEDEC JESD51-3, SEMI Test Method #G43-87, and MIL-STD-883 Method 10121.1. |
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