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BC54_55_56PAS_SER

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Product data sheet

Rev. 1 — 11 November 2014

5 of 14

Nexperia

BC54PAS; BC55PAS; BC56PAS

45V/60V/80V, 1A NPN medium power transistors

6.

Thermal characteristics

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.

[4]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.

[5]

Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2.

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Max

Unit

Rth(j-a)

thermal resistance from junction

to ambient

in free air

[1] 298

K/W

[2] 154

K/W

[3] 151

K/W

[4] 114

K/W

[5] 76

K/W

Rth(j-sp)

thermal resistance from junction

to solder point

in free air

20

K/W

FR4 PCB, single-sided copper, tin-plated and standard footprint

Fig 2.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

006aac683

10

1

102

103

Zth(j-a)

(K/W)

10–1

10–5

10

10–2

10–4

102

10–1

tp (s)

10–3

103

1

0

duty cycle = 1

0.01

0.05

0.1

0.2

0.33

0.5

0.75

0.02

0.25