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STM32U595AI Datasheet(PDF) 372 Page - STMicroelectronics

No. de pieza STM32U595AI
Descripción Electrónicos  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU,240 DMIPS, up to 4 MB Flash, 2.5 MB SRAM, LTDC, MIPI® DSI
PDF  377 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U595AI Datasheet(HTML) 372 Page - STMicroelectronics

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Package information
STM32U59xxx
372/377
DS13633 Rev 1
Device marking for TFBGA216
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which also depend on supply chain operations,
are not indicated below.
Figure 107. TFBGA216 marking example (package top view)
1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
6.9
Package thermal characteristics
The maximum chip-junction temperature, TJ max, in degrees Celsius, can be calculated
using the following equation:
TJ max = TA max + (PD max * ΘJA)
where:
•
TA max is the maximum ambient temperature in °C.
•
ΘJA is the package junction-to-ambient thermal resistance in °C/W.
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/O max).
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
MSv69529V1
MSv71175V1
Y
WW
Revision code
Product
identification
(1)
Ball A1
identifier
Date code
NJH6Q
STM32U599
R



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