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STM32H7B3II Datasheet(PDF) 214 Page - STMicroelectronics |
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STM32H7B3II Datasheet(HTML) 214 Page - STMicroelectronics |
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214 / 238 page ![]() 7.9 UFBGA169 package information This UFBGA is a 169 balls, 7 x 7 mm, 0.50 mm pitch, ultra thin profile fine pitch ball grid array package Figure 106. UFBGA169 - Outline Seating plane A2 A1 A e F F e N A BOTTOM VIEW E D TOP VIEW Øb (169 balls) Y X Y eee Ø M fff Ø M Z Z X A1 ball identifier A1 ball index area b D1 E1 A4 A3 13 1 Z Z ddd SIDE VIEW UFBGA169 package (package code A0YV) 1. Drawing is not to scale. 2. – The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. – A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. STM32H7B3xI UFBGA169 package information DS13139 - Rev 8 page 214/238 |
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