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STM32H7B3II Datasheet(PDF) 217 Page - STMicroelectronics |
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STM32H7B3II Datasheet(HTML) 217 Page - STMicroelectronics |
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217 / 238 page ![]() 7.10 UFBGA(176+25) package information This UFBGA is a 176+25 balls, 10 x 10 mm, 0.65 mm pitch, ultra thin profile fine pitch ball grid array package. Figure 109. UFBGA(176+25) - Outline Seating plane A2 C ddd A1 A e F F e R A 15 1 BOTTOM VIEW E D TOP VIEW Øb (176 + 25 balls) B A B eee Ø M fff Ø M C C A C A1 ball identifier A1 ball index area b A4 E1 A3 D1 Package UFBGA 176+25 (package code A0E7) 1. Drawing is not to scale. 2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. STM32H7B3xI UFBGA(176+25) package information DS13139 - Rev 8 page 217/238 |
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