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SAM9X60SIP Datasheet(PDF) 27 Page - Microchip Technology

No. de pieza SAM9X60SIP
Descripción Electrónicos  SAM9X60 System-In-Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM and up to 64 Mbits SDR-SDRAM
PDF  40 Pages
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SAM9X60SIP Datasheet(HTML) 27 Page - Microchip Technology

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© 2019 Microchip Technology Incorporated
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
Terminal A1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Ball Pitch
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
e
E
N
0.80 BSC
0.38
-
0.27
0.40
12.80 BSC
-
0.32
14.00 BSC
MILLIMETERS
MIN
NOM
233
0.48
1.20
0.37
MAX
Overall Length
Overall Ball Pitch
D
D1
14.00 BSC
12.80 BSC
Microchip Technology Drawing C04-21501 Rev A Sheet 2 of 2
233-Ball Thin Fine Pitch Ball Grid Array (4FB) - 14x14 mm Body [TFBGA]
SAM9X60 SIP
Mechanical Characteristics
© 2021 Microchip Technology Inc.
and its subsidiaries
Datasheet
DS60001580C-page 27



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