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ST33TPHF2XSPI Datasheet(PDF) 21 Page - STMicroelectronics |
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ST33TPHF2XSPI Datasheet(HTML) 21 Page - STMicroelectronics |
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21 / 35 page ![]() 6.2 Thermal characteristics of packages The table below provides the thermal characteristics of the VFQFPN32 package. Table 13. Thermal characteristics Parameter Symbol Value Recommended operating temperature range Ambient temperature TA −40 to 105 °C Case temperature TC - Junction temperature TJ −43 to 108 °C Absolute maximum junction temperature - 125 °C Maximum power dissipation - 63 mW Theta-JA, -JB and -JC Junction to ambient thermal resistance θJA(1) 35.8 at 0 lfpm (2) Junction to case thermal resistance θJC 1.48 at 0 lfpm(2) Junction to board thermal resistance θJB 13.9 at 0 lfpm(2) 1. According to JESD51-2 (still air condition). 2. Linear feet per minute. ST33TPHF2XSPI Thermal characteristics of packages DS14186 - Rev 1 page 21/35 |
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