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HCS166D Datasheet(PDF) 4 Page - Renesas Technology Corp

No. de pieza HCS166D
Descripción Electrónicos  Radiation Hardened 8-Bit Parallel-Input/Serial Output Shift Register
PDF  9 Pages
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Fabricante Electrónico  RENESAS [Renesas Technology Corp]
Página de inicio  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HCS166D Datasheet(HTML) 4 Page - Renesas Technology Corp

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HCS166MS
FN2482 Rev 2.00
Page 4 of 9
September 1995
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
(NOTES 1, 2)
CONDITIONS
GROUP
A SUB-
GROUPS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
CP or CE to Q7
TPHL
TPLH
VCC = 4.5V
9
+25oC
2
32
ns
10, 11
+125oC, -55oC
2
37
ns
MR to Q7
TPHL
VCC = 4.5V
9
+25oC
2
31
ns
10, 11
+125oC, -55oC
2
36
ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500
, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
SYMBOL
(NOTE 1)
CONDITIONS
TEMPERATURE
LIMITS
UNITS
MIN
MAX
Capacitance Power Dissipation
CPD
VCC = 5.0V, f = 1MHz
+25oC
-
65
pF
+125oC, -55oC
-
81
pF
Input Capacitance
CIN
VCC = 5.0V, f = 1MHz
+25oC
-
10
pF
+125oC
-
10
pF
Output Transition Time
(Figure 1)
TTHL
TTLH
VCC = 4.5V
+25oC
-
15
ns
+125oC, -55oC
-
22
ns
Clock Frequency (Figure 1)
fmax
VCC = 4.5V
+25oC30
-
MHz
-55oC to +125oC20
-
MHz
MR Pulse Width (Figure 2)
tw
VCC = 4.5V
+25oC20
-
ns
-55oC to +125oC30
-
ns
Clock Pulse Width (Figure 1)
tw
VCC = 4.5V
+25oC16
-
ns
-55oC to +125oC24
-
ns
Set-up Time Data and CE to
Clock, (Figure 3, 4)
tSU
VCC = 4.5V
+25oC16
-
ns
-55oC to +125oC24
-
ns
Hold Time Data to Clock
(Figure 4)
tH
VCC = 4.5V
+25oC1
-
ns
-55oC to +125oC1
-
ns
Removal Time MR to Clock
(Figure 3)
tREM
VCC = 4.5V
+25oC0
-
ns
-55oC to +125oC0
-
ns
Set-up Time PE to CP (Figure 4)
tSU
VCC = 4.5V
+25oC29
-
ns
-55oC to +125oC44
-
ns
Hold Time PE to CP or CE
(Figure 4)
tH
VCC = 4.5V
+25oC0
-
ns
-55oC to +125oC0
-
ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.



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