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HCS245MS Datasheet(PDF) 7 Page - Renesas Technology Corp |
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HCS245MS Datasheet(HTML) 7 Page - Renesas Technology Corp |
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7 / 8 page ![]() HCS245MS FN2468 Rev 1.00 Page 7 of 8 December 1992 Die Characteristics DIE DIMENSIONS: 124 x 110 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å -2.6kÅ DIE ATTACH: Material: Silver Epoxy WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS245MS DIR (1) A0 (2) A6 (8) (13) B5 VCC (20) NC NC NC NC OE (19) A1 (3) A2 (4) A3 (5) A4 (6) A5 (7) A7 (9) GND (10) B7 (11) B6 (12) (14) B4 (15) B3 (16) B2 (17) B1 (18) B0 |
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