LM324ADE4 datasheet(7/55 Pages) TI

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6.4 Thermal Information

THERMAL METRIC(1)

LMx24, LM2902

LMx24

UNIT

(SOIC)

(SSOP)

(PDIP)

(SO)

(TSSOP)

(LCCC)

(CDIP)

(CFP)

14 PINS

20 PINS

14 PINS

RθJA (2) (3)

Junction-to-

ambient thermal

resistance

113

—

°C/W

RθJC (4)

Junction-to-case

(top) thermal

resistance

—

5.61

15.05

14.65

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

(3)

Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

(4)

Maximum power dissipation is a function of TJ(max), RθJA, and TC. The maximum allowable power dissipation at any allowable case

temperature is PD = (TJ(max) – TC)/RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.

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LM124, LM124A, LM224, LM224A, LM224K, LM224KA

LM324, LM324A, LM324B, LM324K, LM324KA

LM2902, LM2902B, LM2902K, LM2902KV, LM2902KAV

SLOS066Z – SEPTEMBER 1975 – REVISED APRIL 2023

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LM324KA LM2902 LM2902B LM2902K LM2902KV LM2902KAV

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