Nexperia

BAS30LS

High-speed switching diode

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1]

-

-

375

K/W

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[2]

-

-

205

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided, 70 µm copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided, 70 µm copper, tin-plated mounting pad for cathode 1cm2.

aaa-033761

103

Zth(j-a)

(K/W)

10-2

tp (s)

10-6

103

10-1

1

10

102

102

10

1

10-1

10-2

10-3

10-4

10-5

duty cycle = 1

0

0.01

0.02

0.75

0.50

0.20

0.10

0.05

0.25

0.33

FR4 PCB, 70 μm single sided copper, standard footprint

Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

aaa-033762

103

Zth(j-a)

(K/W)

10-2

tp (s)

10-6

103

10-1

1

10

102

102

10

1

10-1

10-2

10-3

10-4

10-5

duty cycle = 1

0.01

0.02

0.75

0.50

0.20

0.10

0.05

0.25

0

0.33

FR4 PCB, 70 μm single sided copper, mounting pad for cathode 1 cm2

Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

BAS30LS

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Product data sheet

3 November 2021

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