2000 Sep 05

9

Philips Semiconductors

Product specification

Integrated rotational speed sensor

KMI16/1

PACKAGE OUTLINE

UNIT

bp

c

Q

L2

L1

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

1.7

1.4

0.8

0.7

bp1

1.57

1.47

5.7

5.5

4.1

3.9

0.3

0.24

1.2

0.9

3.9

3.5

M1

8.15

7.85

M2

8.15

7.85

M3

(1)

4.7

4.3

L

7.55

7.25

D1

(2)

4.5

4.3

5.7

5.5

4.6

4.4

E1

(2)

18.2

17.8

HE

5.6

5.5

HE1

K

max.

5.37

e

2.35

2.15

e1

0.25

0.75

0.65

DIMENSIONS (mm are the original dimensions)

SOT477B

99-09-23

00-08-31

0

2.5

5 mm

scale

Plastic single-ended multi-chip package;

magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads

SOT477B

e

12

3

e1

E

E1

HE1

L1

D

L

bp1

D1

SENSOR DIE POSITION

*

centre of reading point

HE

M1

L2

bp

c

Q

A

K

M2

M3

B

A

Notes

1. Glue thickness not included.

2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.