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PLUS16R6DN Datasheet(PDF) 9 Page - NXP Semiconductors |
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PLUS16R6DN Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 16 page ![]() TEMPERATURE Maximum junction Maximum ambient Allowable thermal rise ambient to junction 150 °C 75 °C 75 °C Philips Semiconductors Programmable Logic Devices Product specification PLUS16R8D/-7 SERIES PAL devices 16L8, 16R8, 16R6, 16R4 September 10, 1993 44 ABSOLUTE MAXIMUM RATINGS1 THERMAL RATINGS RATINGS SYMBOL PARAMETER MIN MAX UNIT VCC Supply voltage –0.5 +7 VDC VIN Input voltage –1.2 +8.0 VDC VOUT Output voltage –0.5 VCC + 0.5V VDC IIN Input currents –30 +30 mA IOUT Output currents +100 mA Tstg Storage temperature range –65 +150 °C NOTE: 1. Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only. Functional operation at these or any other condition above those indicated in the operational and programming specification of the device is not implied. OPERATING RANGES RATINGS SYMBOL PARAMETER MIN MAX UNIT VCC Supply voltage +4.75 +5.25 VDC Tamb Operating free–air temperature 0 +75 °C |
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