CS5212

http://onsemi.com

2

C16

0.1 mF

GATE(H)

BST

LGND

COMP

SGND

PGND

GATE(L)

IS+

IS−

CS5212

U1

GN2

GND

R8

10

C2

0.1 mF

TP4

COMP

TP5

BST

1

2

3

4

5

6

7

14

13

12

11

10

9

8

C11

0.1 mF

R1

51 k

C1

0.47 mF

R9

10

C19

1.0 mF

Q2

Q1

TP3

GATE(L)

TP2

GATE(H)

TP1

SWNODE

3.3 V

D5

BAT54S

+

+

+

C6

C7

C8 100 mF/10 V × 3

R5

4.7 k

R13

10

C15

470 pF

L1

2.9 mH

6.5 mR

ETQP6F2R9LB

GND

C3

0.1 mF

R6

4.7 k

R2

10

TP6

SENSE+

TP7

SENSE−

R4

1.0 k 1%

C5

680 pF

R3

1.5 k 1%

R7

TBD*

D6

BAT54S

D2

BAT54S

C4

0.1 mF

C22

0.1 mF

*Refer to Rpullup Value Selection section for value needed.

+

C9

+

C10

100 mF/10 V

× 2

+

C20

+

C21

Figure 1. Application Diagram, 3.3 V to 1.5 V/8.0 A Converter with Differential Remote Sense

MAXIMUM RATINGS

Rating

Value

Unit

150

°C

Lead Temperature Soldering:

Reflow: (SMD styles only) (Note 1)

230 peak

°C

−65 to +150

°C

Package Thermal Resistance:

30

125

°C/W

°C/W

ESD Susceptibility:

Human Body Model

Machine Model

2.0

200

kV

V

JEDEC Moisture Sensitivity

1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. 60 second maximum above 183°C.