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ES9039MSPRO Datasheet(PDF) 93 Page - ESS Technology,Inc

No. de pieza ES9039MSPRO
Descripción Electrónicos  32-bit High-Performance 8-Channel DAC
PDF  95 Pages
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Fabricante Electrónico  ESS [ESS Technology,Inc]
Página de inicio  http://www.esstech.com
Logo ESS - ESS Technology,Inc

ES9039MSPRO Datasheet(HTML) 93 Page - ESS Technology,Inc

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ES9039MPRO & ES9039PRO Datasheet
CONFIDENTIAL ADVANCE INFORMATION 0.2.1
93
ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM
RPC-2 Pb-Free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3, <350
Volume mm3, 350 to 2000
Volume mm3, >2000
<1.6 mm
260°C
260°C
260°C
1.6 mm – 2.5 mm
260°C
250°C
245°C
>2.5 mm
250°C
245°C
245°C
Table 11 – RPC-2 Pb free classification temperatures
At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the
values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc).
Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes
reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.



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