LM339LVRTER datasheet(7/66 Pages) TI1

7 / 66 page

5.5 Thermal Information, LM393LV

THERMAL METRIC (1)

LM393LV

UNIT

(SOIC)

(TSSOP)

DGK

(VSSOP)

DSG

(WSON)

DDF

(SOT-23)

8 PINS

RqJA

Junction-to-ambient thermal resistance

167.7

221.7

215.8

175.2

240.0

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

107.0

109.1

105.2

178.1

151.0

°C/W

RqJB

Junction-to-board thermal resistance

111.2

152.5

137.5

139.5

157.0

°C/W

yJT

Junction-to-top characterization parameter

53.1

36.4

39.6

47.2

32.8

°C/W

yJB

Junction-to-board characterization parameter

110.4

150.7

135.9

138.9

155.4

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

127.3

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Thermal Information, LM339LV

THERMAL METRIC(1)

LM339LV

UNIT

D (SOIC)

(TSSOP)

RTE

(WQFN)

DYY

(SOT-23)

14 PINS

16 PINS

14 PINS

RqJA

Junction-to-ambient thermal resistance

136.0

155.0

134.1

211.1

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

91.2

82.0

122.6

121.1

°C/W

RqJB

Junction-to-board thermal resistance

92.0

98.5

109.3

120.4

°C/W

yJT

Junction-to-top characterization parameter

46.9

25.7

30.9

22.3

°C/W

yJB

Junction-to-board characterization parameter

91.6

97.6

108.3

120.1

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

98.7

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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TL331LV, TL391LV, LM393LV, LM339LV

SNOSDA4D – JUNE 2020 – REVISED NOVEMBER 2023

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Product Folder Links: TL331LV TL391LV LM393LV LM339LV

LM339LVRTER Datasheet(PDF) 7 Page - Texas Instruments

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