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STTH8R06FP Datasheet(PDF) 5 Page - STMicroelectronics |
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STTH8R06FP Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() STTH8R06 Package information 5/12 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC) ● Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC) Figure 13. Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU = 35 µm) (D2PAK) 0 10 20 30 40 50 60 70 0 5 10 15 20 25 30 35 40 S(Cu)(cm²) R (°C/W) th(j-a) |
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