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PCF8579 Datasheet(PDF) 31 Page - NXP Semiconductors

No. de pieza PCF8579
Descripción Electrónicos  LCD column driver for dot matrix graphic displays
PDF  40 Pages
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8579 Datasheet(HTML) 31 Page - NXP Semiconductors

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1997 Apr 01
31
Philips Semiconductors
Product specification
LCD column driver for dot matrix graphic
displays
PCF8579
15 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Chip area: 14.37 mm2.
Bonding pad dimensions: 120
µm × 120 µm.
Gold bump dimensions (if ordered): 94
× 94 × 25 µm.
The numbers given in the square boxes refer to the pad number.
MSA920
PCF8579
4.76
mm
3.02 mm
VLCD
A2
n.c.
V3
V4
C39
C38
C37
C36
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
C22
VDD
A1
A0
x
y
0
0
56
1
255
54
53
52
51
50
3
4
5
6
7
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
Fig.24 Bonding pad locations.



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