ams Datasheet

Page 39

[v1-31] 2018-Apr-04

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TCS3771 − Packaging Mechanical Data

Figure 47:

Package FN - Dual Flat No-Lead Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerance of ±75μm.

3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

Packaging Mechanical Data

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