TMF8701 datasheet(57/66 Pages) OSRAM

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[v2-00] 2023-Feb-21

TMF8701 − Soldering & Storage Information

Figure 122:

Solder Reflow Profile

Storage Information

Moisture Sensitivity

Optical characteristics of the device can be adversely affected

during the soldering process by the release and vaporization of

moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of

absorbed moisture possible, each device is baked prior to being

dry packed for shipping. Devices are dry packed in a sealed

aluminized envelope called a moisture-barrier bag with silica

gel to protect them from ambient moisture during shipping,

handling, and storage before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture

barrier bag is 24 months from the date code on the bag when

stored under the following conditions:

• Shelf Life: 24 months

• Ambient Temperature: <40°C

• Relative Humidity: <90%

Rebaking of the devices will be required if the devices exceed

the 24 months shelf life or the Humidity Indicator Card shows

that the devices were exposed to conditions beyond the

allowable moisture region.

Parameter

Reference

Device

Average temperature gradient in preheating

2.5°C/s

Soak time

tsoak

2 to 3 minutes

Time above 217 °C (T1)

Max 60s

Time above 230 °C (T2)

Max 50s

Time above Tpeak – 10 °C (T3)

Max 10s

Peak temperature in reflow

Tpeak

260°C

Temperature gradient in cooling

Max −5°C/s

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