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FDN360P Datasheet(PDF) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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FDN360P Datasheet(HTML) 1 Page - EVER SEMICONDUCTOR CO.,LIMITED |
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1 / 5 page ![]() General Description These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required. Features Low gate charge (6.2 nC typical) High performance trench technology for extremely low RDS(ON) . High power version of industry Standard SOT-23 package. higher power handling capability. D S G Absolute Maximum Ratings TA=25 oC unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage –30 V VGSS Gate-Source Voltage ±20 V ID Drain Current – Continuous (Note 1a) –2 A – Pulsed –10 Power Dissipation for Single Operation (Note 1a) 0.5 PD (Note 1b) 0.46 W TJ, TSTG Operating and Storage Junction Temperature Range –55 to +150 °C Thermal Characteristics RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 250 °C/W RθJC Thermal Resistance, Junction-to-Case (Note 1) 75 °C/W SOT–23 1. GATE 2. SOURCE 3. DRAIN Rev:2023A2 1 l l VDS (V) = -30V I D= -2A (VGS=10V) l RDS(ON) 80m (VGS = -10V) l RDS(ON) 125m (VGS = -4.5V) l l l l P-Channel 2.5 V (D-S) MOSFET FDN336 |
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