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MPC826XACVR Datasheet(PDF) 46 Page - Freescale Semiconductor, Inc

No. de pieza MPC826XACVR
Descripción Electrónicos  PowerQUICC??II Integrated Communications Processor Hardware Specifications
PDF  52 Pages
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC826XACVR Datasheet(HTML) 46 Page - Freescale Semiconductor, Inc

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MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1
46
Freescale Semiconductor
Package Description
Symbols used in Table 20 are described in Table 21.
5
Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1
Package Parameters
Package parameters are provided in Table 22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA.
Table 21. Symbol Legend
Symbol
Meaning
OVERBAR
Signals with overbars, such as TA, are active low.
UTM
Indicates that a signal is part of the UTOPIA master interface.
UTS
Indicates that a signal is part of the UTOPIA slave interface.
UT8
Indicates that a signal is part of the 8-bit UTOPIA interface.
UT16
Indicates that a signal is part of the 16-bit UTOPIA interface.
MII
Indicates that a signal is part of the media independent interface.
Table 22. Package Parameters
Parameter
Value
Package Outline
37.5 x 37.5 mm
Interconnects
480 (29 x 29 ball array)
Pitch
1.27 mm
Nominal unmounted package height 1.55 mm



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