LT1126/LT1127

11267fa

9

PACKAGE DESCRIPTIO

N8 Package

8-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

N8 1002

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.130

± .005

(3.302

± 0.127)

.020

(0.508)

MIN

.018

± .003

(0.457

± 0.076)

.120

(3.048)

MIN

12

3

4

87

6

5

.255

± .015*

(6.477

± 0.381)

.400*

(10.160)

MAX

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC

S8 Package

8-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

J Package

14-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

°– 8° TYP

.008 – .010

(0.203 – 0.254)

SO8 0303

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

1

2

3

4

.150 – .157

(3.810 – 3.988)

NOTE 3

8

7

6

5

.189 – .197

(4.801 – 5.004)

NOTE 3

.228 – .244

(5.791 – 6.197)

.245

MIN

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

OBSOLETE PACKAGE

J14 0801

.045 – .065

(1.143 – 1.651)

.100

(2.54)

BSC

.014 – .026

(0.360 – 0.660)

.200

(5.080)

MAX

.015 – .060

(0.381 – 1.524)

.125

(3.175)

MIN

.300 BSC

(7.62 BSC)

.008 – .018

(0.203 – 0.457)

0

° – 15°

1

23

4

56

7

.220 – .310

(5.588 – 7.874)

.785

(19.939)

MAX

.005

(0.127)

MIN

14

11

8

9

10

13

12

.025

(0.635)

RAD TYP

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS