| Motor de Búsqueda de Datasheet de Componentes Electrónicos |
|
PS5162 Datasheet(PDF) 2 Page - Microchip Technology |
|
|
|||||||||||||||||||||||||||||
PS5162 Datasheet(HTML) 2 Page - Microchip Technology |
|
2 / 10 page ![]() PS5162 DS21842B-page 2 2004 Microchip Technology Inc. 1.0 GENERAL DESCRIPTION The PS5162 module is a complete smart battery controller subsystem based on the Microchip PS501 field reprogrammable battery manager with patented Accuron® technology. The module is designed to oper- ate in a battery pack consisting of two (2) series con- nected Li-based cells. The module consists of the Microchip PS501 battery manager IC with a four-LED SOC display and an optional connection for an external thermistor. 1.1 Quick Start – Pack Assembly Follow these directions to assemble a pack with the PS5162 module. • Use standard precautions when handling static sensitive devices. • Modules should be connected to battery cells in the order indicated below to insure proper start-up and operation. Wires should be attached to the modules first and then connected to the battery cells as instructed. • The connection sequence is critical to successful use of the PS501 family of CMOS ASICs. The pack positive should be securely connected to the module first, followed by the intermediate cell connection and then pack negative. Step 1) Configure the module for optional external thermistor use. PS5162 modules are shipped configured to use the internal tem- perature sensor only. To add an external thermistor to the board, remove resistor R16 (side 2) and connect the thermistor across via TN and TR. Step 2) Connect wires to module. Use large diame- ter wire (18 AWG-20 AWG) for current carrying lines from VR, V1, BP and BN. All others are signal only lines (24 to 22 AWG). Step 3) Connect external connector to BN, T, C, D and BP. Step 4) Connect V1 to the most positive point on the battery cell stack. Step 5) Connect V2 to the middle of the cell stack. Step 6) Connect VR to the most negative point on the battery cell stack. Step 7) Program the assembled pack using Microchip’s software and PowerCal™ board or PowerInfo™ board hardware. The memory parameters can be changed at will using the utilities on the memory page in the software. Step 8) Calibrate the pack using the software and PowerCal™ board hardware. The pack is now ready for use. FIGURE 1-1: CONNECTION POINTS (SIDE 1) |
|
|
Enlace URL |
| ¿ALLDATASHEET es útil para Ud.? [ DONATE ] |
Todo acerca de Alldatasheet | Publicidad | Contáctenos | Política de Privacidad | Enlace a la hoja de datos | Intercambio de Enlaces | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |