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ICS524MILF Datasheet(PDF) 5 Page - Integrated Device Technology

No. de pieza ICS524MILF
Descripción Electrónicos  LOW SKEW 1 TO 4 CLOCK BUFFER
PDF  7 Pages
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Fabricante Electrónico  IDT [Integrated Device Technology]
Página de inicio  http://www.idt.com
Logo IDT - Integrated Device Technology

ICS524MILF Datasheet(HTML) 5 Page - Integrated Device Technology

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ICS524
LOW SKEW 1 TO 4 CLOCK BUFFER
FAN OUT BUFFER
IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER
5
ICS524
REV A 101705
AC Electrical Characteristics
VDD = 2.5 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
VDD = 3.3 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
VDD = 5 V ±5%, Ambient Temperature -40 to +85°C, unless stated otherwise
Notes: 1. With rail to rail input clock
2. Between any 2 outputs with equal loading.
3. Duty cycle on outputs will match incoming clock duty cycle. Consult ICS for tight duty cycle clock
generators.
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
1.0
1.5
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
1.0
1.5
ns
Propagation Delay
Note 1
2.2
3
5
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
0.6
1.0
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
0.6
1.0
ns
Propagation Delay
Note 1
2.0
2.4
4
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Input Frequency
0
200
MHz
Output Rise Time
tOR
0.8 to 2.0 V, CL=15 pF
0.3
0.7
ns
Output Fall Time
tOF
2.0 to 0.8 V, CL=15 pF
0.3
0.7
ns
Propagation Delay
Note 1
1.8
2.5
4
ns
Output to Output Skew
Note 2
Rising edges at VDD/2
0
50
ps
Device to Device Skew
Rising edges at VDD/2
500
ps
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air
150
°C/W
θ
JA
1 m/s air flow
140
°C/W
θ
JA
3 m/s air flow
120
°C/W
Thermal Resistance Junction to Case
θ
JC
40
°C/W



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