Symbol

Interposer PoP – Current HVM (mm)

Min

Max

Nom

A1 (Mounted, 0.35 Pitch)

0.115

0.155

0.135

A2 (3L Laminate)

0.090

0.150

0.120

A3 (Mold Cap)

0.130

0.170

0.150

B1 (2L Laminate)

0.075

0.115

0.095

B2 Overall Package Height

0.410

0.590

0.500

Interposer PoP

Interposer PoP Stack-up Table (Reference Example)

Interposer PoP Design Table

A

B

C

D

E

Package Size (mm) 1

Die Size (mm)

BGA Count to MB

(0.35 mm Pitch)

Interposer Connections

(Bottom Substrate:

Top Interposer) 2

Memory BGA Pads

(Memory I/O Count) 3

11 x 11

7 x 7

1050

2 Sides: 234

4 Sides: 432

560

12 x 12

8 x 8

1235

2 Sides: 258

4 Sides: 480

672

13 x 13

9 x 9

1512

2 Sides: 282

4 Sides: 528

828

14 x 14

10 x 10

1732

2 Sides: 306

4 Sides: 576

960

15 x 15

11 x 11

1992

2 Sides: 324

4 Sides: 612

1100

17 x 17

14 x 14

2613

2 Sides: 372

4 Sides: 708

1512

1

Package sizes above/below this range are possible depending on structure

2

Connection to interposer typically done on 2 sides due to substrate M1 routing constraints; 4 side connection possible depending on design constraints (change in die aspect ratio can

change total count)

3

Memory I/O assumes 5 x 5 mm area for substrate marking; increased I/O count can be achieved if memory area is reduced

*BGA side passives available at pitches >/=0.35 mm

*Both thinner & thicker stack-ups are available. Please contact Sales/Business team for specific design requirements

C

A

B

D

E

B1

B2

A3

A2

A1