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REF5010 Datasheet(PDF) 6 Page - Texas Instruments |
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REF5010 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 49 page ![]() 6.4 Thermal Information THERMAL METRIC(1) REF50xxEI REF50xxI , REF50xxAI UNIT D (SOIC) D (SOIC) DGK (VSSOP) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 120 115 160.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52 63.4 53.9 °C/W RθJB Junction-to-board thermal resistance 66 57.1 82.9 °C/W ΨJT Junction-to-top characterization parameter 9.8 15.4 5.1 °C/W ΨJB Junction-to-board characterization parameter 64.7 56.2 80.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. REF5010, REF5020, REF5025, REF5030, REF5040, REF5045, REF5050 SBOS410M – JUNE 2007 – REVISED DECEMBER 2024 www.ti.com 6 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050 |
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