Data Sheet

ADPL40502

analog.com

Rev. 0

5 of 17

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise specified.

Table 3. Absolute Maximum Ratings

PARAMETER

RATING

VIN to GND

−0.3V to +6.5V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3V to +6.5V

Temperature Range

Storage

−65°C to +150°C

Operating Junction

−40°C to +125°C

Operating Ambient

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product.

This is a stress rating only; functional operation of the product at these or any other conditions above those indicated

in the operational section of this specification is not implied. Operation beyond the maximum operating conditions

for extended periods may affect product reliability.

Thermal Data

Absolute maximum ratings apply individually only, not in combination. The ADPL40502 can be damaged when the

junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum

ambient temperature may have to be derated.

In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the

maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within

specification limits. TJ of the device is dependent on TA, the power dissipation of the device (PD), and the junction to

ambient thermal resistance of the package (θJA).

To calculate the maximum TJ from TA and PD use the following equation:

TJ = TA + (PD × θJA)

The θJA of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the

application and board layout. In applications where high maximum PD exists, close attention to thermal board design

is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The

specified values of θJA are based on a 4-layer, 4 inches × 3 inches circuit board. See JESD51-7 and JESD51-9 for

detailed information on the board construction.

ΨJB is the junction to board, thermal characterization parameter with units of °C/W. ΨJB of the package is based on

modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic

Package Thermal Information, states that thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path

as in θJB.