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DCTPACKAGE

(TOP VIEW)

DCUPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

1

V

CC

8

1A

2

7

1B

1Y

3

6

2Y

2B

4

5

GND

2A

3

6

2B

2Y

8

1

V

CC

1A

5

GND

4

2A

2

7

1Y

1B

GND

5

4

2A

3 6

2B

2Y

2 7

1Y

1B

8

V

CC

1

1A

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G08

DUAL 2-INPUT POSITIVE-AND GATE

SCES198L – APRIL 1999 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Typical V

NanoFree™ Package

V

• Supports 5-V V

• I

Operation

• Inputs Accept Voltages to 5.5 V

• Latch-Up Performance Exceeds 100 mA Per

• Max t

JESD 78, Class II

• Low Power Consumption, 10-µA Max I

CC

• ESD Protection Exceeds JESD 22

• ±24-mA Output Drive at 3.3 V

–

2000-V Human-Body Model (A114-A)

• Typical V

–

1000-V Charged-Device Model (C101)

at V

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74LVC2G08YZPR

_ _ _CE_

(Pb-free)

–40

°C to 85°C

SSOP – DCT

Reel of 3000

SN74LVC2G08DCTR

C08_ _ _

Reel of 3000

SN74LVC2G08DCUR

VSSOP – DCU

C08_

Reel of 250

SN74LVC2G08DCUT

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.