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TMP235, TMP236

SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019

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Copyright © 2017–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 6

7

Detailed Description .............................................. 8

7.1

Overview ................................................................... 8

7.2

Functional Block Diagram ......................................... 8

7.3

Feature Description................................................... 8

7.4

Device Functional Modes........................................ 10

8

Application and Implementation ........................ 11

8.1

Application Information............................................ 11

8.2

Typical Application .................................................. 11

9

Power Supply Recommendations ...................... 12

10

Layout................................................................... 12

10.1

Layout Guidelines ................................................. 12

10.2

Layout Examples................................................... 12

11

Device and Documentation Support ................. 13

11.1

Related Links ........................................................ 13

11.2

Receiving Notification of Documentation Updates 13

11.3

Community Resources.......................................... 13

11.4

Trademarks ........................................................... 13

11.5

Electrostatic Discharge Caution ............................ 13

11.6

Glossary ................................................................ 13

12

Mechanical, Packaging, and Orderable

Information ........................................................... 13

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (August 2018) to Revision E

Page

•

Changed recommended operating temperature range from: –50°C to 150°C to: –40°C to 150°C ....................................... 4

•

Changed power supply bypassing recommendations on how to avoid noise effect on the device output .......................... 12

Changes from Revision C (August 2018) to Revision D

Page

•

Changed DBZ (SOT-23) package status from preview to production data............................................................................ 1

Changes from Revision B (February 2018) to Revision C

Page

•

Added DBZ (SOT-23) preview package ................................................................................................................................ 1

•

Added TMP236 test conditions to the operating current parameters..................................................................................... 5

•

Added SOT-23 and SC70 package test conditions to the Accuracy Level 2 (A2) limits in the 0

℃ to 70℃ range ................ 5

Changes from Revision A (December 2017) to Revision B

Page

•

Changed reference to typical accuracy specifications from: ±1°C and ±2°C to: ±0.5°C and ±1°C........................................ 1

•

Deleted erroneous AOQL footnote ......................................................................................................................................... 5

•

Changed specification limits indicated in Figure 1 ................................................................................................................. 6

•

Added Device Functional Modes section ............................................................................................................................ 10

Changes from Original (September 2017) to Revision A

Page

•

Changed document status from Advance Information to Production Data ............................................................................ 1