Package information

MP23AB01DH

8/12

DocID030017 Rev 2

5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

Soldering information

Figure 4: Recommended soldering profile limits

Table 6: Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

TL to TP

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

Time (TSMIN to TSMAX)

TSMIN

TSMAX

tS

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

TSMAX to TL

Time maintained above liquidus temperature Liquidus temperature

tL

TL

60 sec to 150 sec

217 °C

Peak temperature

TP

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t = 25 °C) to peak temperature

8 minutes max

RAMP-DOWN

RAMP-UP

t

s

PREHEAT

t

L

t

p

T

L to T P

T

SMAX

T

SMIN

T

P

T

L

30 60 90

120 150 180

210

240

270

300

330

360 390

T25° to PEAK

CRITICAL ZONE

TIME