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L4995 Datasheet(PDF) 24 Page - STMicroelectronics |
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L4995 Datasheet(HTML) 24 Page - STMicroelectronics |
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24 / 36 page ![]() DS5053 Rev 15 25/37 L4995 Package and PCB thermal data 36 4.2 PowerSSO-24 thermal data Figure 35. PowerSSO-24 PC board Note: Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70 m (front and back side) Thermal vias separation 1.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm, Footprint dimension 4.1 mm x 6.5 mm). Figure 36. Rthj-amb vs PCB copper area in open box free air condition GAPGCFT00418 |
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