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STM32F031X4 Datasheet(PDF) 99 Page - STMicroelectronics

No. de pieza STM32F031X4
Descripción Electrónicos  ARM®-based 32-bit MCU with up to 32 Kbyte Flash, 9 timers, ADC and communication interfaces, 2.0 - 3.6 V
PDF  106 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F031X4 Datasheet(HTML) 99 Page - STMicroelectronics

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STM32F031x4 STM32F031x6
Package information
102
7.7
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 18: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
•
TA max is the maximum ambient temperature in °C,
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
7.7.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 68. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
55
°C/W
Thermal resistance junction-ambient
UFQFPN32 - 5 × 5 mm
38
Thermal resistance junction-ambient
LQFP32 - 7 × 7 mm
56
Thermal resistance junction-ambient
UFQFPN28 - 4 × 4 mm
118
Thermal resistance junction-ambient
WLCSP25 - 2.13 x 2.07 mm
74
Thermal resistance junction-ambient
TSSOP20 - 6.5 x 4.4 mm
110



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