TAS2521

SLAS687A – FEBRUARY 2013 – REVISED FEBRUARY 2013

www.ti.com

Table 2-1. RGE PIN FUNCTIONS (continued)

PIN

I/O(1)

DESCRIPTION

NAME

NO.

MISO

17

O

SPI Serial Data Output

GPIO/DOUT

18

I/O/Z

GPIO / Audio Serial Bus Output

SCL/SSZ

19

I

Either I2C Input Serial Clock or SPI Chip Select Signal depending on SPI_SEL state

SDA/MOSI

20

I

Either I2C Serial Data Input or SPI Serial Data Input depending on SPI_SEL state.

SCLK

21

I

Serial clock for SPI interface

IOVDD

22

PWR

I/O Power Supply, 1.1V - 3.6V

DVDD

23

PWR

Digital Power Supply, 1.65V - 1.95V

DVSS

24

GND

Digital Ground, 0V

3

ELECTRICAL SPECIFICATIONS

3.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

MIN

MAX

AVDD to AVSS

–0.3

2.2

V

DVDD to DVSS

–0.3

2.2

V

SPKVDD to SPKVSS

–0.3

6

V

IOVDD to IOVSS

–0.3

3.9

V

Digital input voltage

IOVSS – 0.3

IOVDD + 0.3

V

Analog input voltage

AVSS – 0.3

AVDD + 0.3

V

Operating temperature range

–40

85

°C

Storage temperature range

–55

150

°C

Junction temperature (TJ Max)

105

°C

QFN

Power dissipation(with thermal pad soldered to board)

(TJ Max – TA) / θJA

W

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

3.2

THERMAL INFORMATION

TAS2521

THERMAL METRIC(1)

UNITS

RGE (24 PINS)

θJA

Junction-to-ambient thermal resistance

32.2

θJCtop

Junction-to-case (top) thermal resistance

30.0

θJB

Junction-to-board thermal resistance

9.2

°C/W

ψJT

Junction-to-top characterization parameter

0.3

ψJB

Junction-to-board characterization parameter

9.2

θJCbot

Junction-to-case (bottom) thermal resistance

2.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

4

ELECTRICAL SPECIFICATIONS

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