23

TLV752

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SBVS383A – DECEMBER 2019 – REVISED MARCH 2020

Product Folder Links: TLV752

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Copyright © 2019–2020, Texas Instruments Incorporated

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder on www.ti.com.

(2)

Output voltages from 0.6 V to 5.0 V in 50-mV increments are available. Contact the factory for details and availability.

11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

Table 3. Device Nomenclature(1)(2)

PRODUCT

VOUT

TLV75201Pyyyz

P indicates an active output discharge feature. All members of the TPS746 family will actively discharge

the output when the device is disabled.

yyy is the package designator.

z is the package quantity. R is for reel (3000 pieces), T is for tape (250 pieces).

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

Texas Instruments, Pros and cons of using a feedforward capacitor with a low-dropout regulator application

report

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.