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TPS1663 Datasheet(PDF) 29 Page - Texas Instruments

No. de pieza TPS1663
Descripción Electrónicos  TPS1663x 60-V, 6-A eFuse with Adjustable Output Power Limiting
PDF  46 Pages
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Fabricante Electrónico  TI2 [Texas Instruments]
Página de inicio  https://www.ti.com
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TPS1663 Datasheet(HTML) 29 Page - Texas Instruments

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input or output of the device. These transients can exceed the Section 7.1 of the device if steps are not taken to
address the issue.
Typical methods for addressing transients include:
• Minimizing lead length and inductance into and out of the device
• Using large PCB GND plane
• Using a Schottky diode across the output and GND to absorb negative spikes
• Using low value ceramic capacitor (C(IN) to approximately 0.1 μF) to absorb the energy and dampen the
transients.
The approximate value of input capacitance can be estimated with Equation 10.
(
)
( )
(
)
( )
( )
IN
spike Absolute
IN
Load
IN
L
V
V
I
C
=
+
´
(10)
where
• V(IN) is the nominal supply voltage
• I(LOAD) is the load current
• L(IN) equals the effective inductance seen looking into the source
• C(IN) is the capacitance present at the input
Some applications can require additional Transient Voltage Suppressor (TVS) to prevent transients from
exceeding the Section 7.1 of the device. These transients can occur during positive and negative surge tests on
the supply lines. In such applications, TI recommends to place at least 1 µF of input capacitor.
The circuit implementation with optional protection components (a ceramic capacitor, TVS and Schottky diode) is
shown in Figure 10-10
TPS16633x
31 PŸ
IN
OUT
dVdT
ILIM
P_IN
RILIM
FLT
GND
SHDN
UVLO
OVP
MODE
IMON
PGOOD
Input
R2
R3
R1
COUT
CdVdT
*
Output
*
* Optional components needed for suppression of transients
Figure 10-10. Circuit Implementation With Optional Protection Components for TPS1663x
10.5 Layout
10.5.1 Layout Guidelines
• For all the applications, TI recommends a 0.1 µF or higher value ceramic decoupling capacitor between IN
terminal and GND.
• High current carrying power path connections must be as short as possible and must be sized to carry at
least twice the full-load current. See Figure 10-11 and Figure 10-12 for a typical PCB layout example.
• Locate all the TPS1663x family support components R(ILIM), R(PLIM), C(dVdT), R(IMON), UVLO, OVP resistors
close to their connection pin. Connect the other end of the component to the GND with shortest trace length.
www.ti.com
TPS1663
SLVSET9F – SEPTEMBER 2018 – REVISED FEBRUARY 2023
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TPS1663



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