Data Sheet

ADRF5703

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 19

Table 4. Absolute Maximum Ratings

Parameter

Rating

Positive Supply Voltage

−0.3V to +3.6V

Negative Supply Voltage

−3.6V to +0.3V

Digital Control Inputs

Voltage

−0.3V to VDD +0.3V

Current

3mA

RF Power1 (f = 3MHz to 20GHz, TCASE = 85°C2)

Dual Supply (VDD = 3.3V, VSS = −3.3V)

Input at ATTIN

Average

27.5dBm

Peak

30.5dBm

Hot Switching

27.5dBm

Input at ATTOUT

Average

24.5dBm

Peak

27.5dBm

Hot Switching

24.5dBm

Single Supply (VDD = 3.3V, VSS = 0V)

Input at ATTIN

Average

20.5dBm

Peak

20.5dBm

Hot Switching

20.5dBm

Input at ATTOUT

Average

20.5dBm

Peak

20.5dBm

Hot Switching

20.5dBm

Unbiased (VDD and VSS = 0V, Input at ATTIN

and ATTOUT)

27dBm

Temperature

Junction (TJ)

135°C

Storage

−65°C to 150°C

Reflow

260°C

1 For RF power handling derating over the extended frequency range, see

Figure 2.

2 For TCASE = 105°C operation, the RF power handling derates from the TCASE =

85°C specifications by 3dB.

Stresses at or above those listed under absolute maximum ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to carrier bottom)

thermal resistance.

Table 5. Thermal Resistance

Package Type

θJC

Unit

CC-24-20

100

°C/W

POWER DERATING CURVE

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C