6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

VDD

-0.3

6

V

Control pins

PORT, ADDR, ID, EN_N, INT_N/OUT3

-0.3

VDD + 0.3

V

CC1, CC2

-0.3

6

SDA/OUT1, SCL/OUT2

-0.3

VDD + 0.3

VBUS_DET

-0.3

4

Storage temperature, Tstg

-65

150

°C

Junction temperature

-40

105

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±7000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage range

2.7

5

V

VBUS

System VBUS voltage

4

5

28

V

VBUS_DET

VBUS_DET threshold voltage on the pin

4

V

TA

TUSB320I Operating free air temperature range

–40

25

85

°C

TUSB320 Operating free air temperature range

0

25

70

°C

6.4 Thermal Information

THERMAL METRIC(1)

TUSB320

UNIT

RWB (X2QFN)

12 PINS

RθJA

Junction-to-ambient thermal resistance

169.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

68.1

°C/W

RθJB

Junction-to-board thermal resistance

83.4

°C/W

ψJT

Junction-to-top characterization parameter

2.2

°C/W

ψJB

Junction-to-board characterization parameter

83.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

www.ti.com

TUSB320, TUSB320I

SLLSEN9F – MAY 2015 – REVISED MARCH 2022

Copyright © 2022 Texas Instruments Incorporated

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