CY28158

Rev 1.0, November 20, 2006

Page 4 of 9

Maximum Ratings

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Supply Voltage..................................................–0.5 to +7.0V

Storage Temperature (Non-Condensing) ....–65 C to +150 C

Max. Soldering Temperature (10 sec) ....................... +260 C

Junction Temperature................................................ +150 C

Package Power Dissipation.............................................. 1W

Static Discharge Voltage

(per MIL-STD-883, Method 3015) ............................. >2000V

Parameter

Description

Min.

Max.

Unit

3.3V Supply Voltages

3.135

3.465

V

CPU Supply Voltage

2.375

2.625

V

IOAPIC Supply Voltage

2.375

2.625

V

Operating Temperature, Ambient

0

70

C

Max. Capacitive Load on

CPU, 48MHZ, REF, IOAPIC

PCI, 3V66

20

30

pF

Reference Frequency, Oscillator Nominal Value

14.318

14.318

MHz

Parameter

Description

Test Conditions

Min. Max. Unit

High-level Input Voltage

2.0

V

Low-level Input Voltage

Except Crystal Pads

0.8

V

High-level Output Voltage

CPU, IOAPIC

2.0

V

48 MHZ, REF, PCI, 3V66

2.4

Low-level Output Voltage

CPU, IOAPIC

0.4

V

48 MHZ, REF, PCI, 3V66

0.4

Input High Current

10

A

Input Low Current

10

A

High-level Output Current

CPU

–16

mA

–60

IOAPIC

–20

–72

48 MHZ, REF

–15

–51

3V66, PCI

–30

–100

Low-level Output Current

CPU

19

mA

49

IOAPIC

25

58

48 MHZ, REF

10

24

3V66, PCI

20

49

Output Leakage Current

Three-state

10

A

2.5V Power Supply

Current

90

mA