SSM2537

Data Sheet

Rev. 0 | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Absolute maximum ratings apply at 25°C, unless otherwise noted.

Table 4.

Parameter

Rating

PVDD Supply Voltage

−0.3 V to +6 V

VDD Supply Voltage

−0.3 V to +2 V

Input Voltage (Signal Source)

−0.3 V to +2 V

ESD Susceptibility

4 kV

OUT− and OUT+ Pins

8 kV

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature Range

−65°C to +165°C

Lead Temperature (Soldering, 60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Junction-to-air thermal resistance (θJA) is specified for the worst-

case conditions, that is, a device soldered in a printed circuit board

(PCB) for surface-mount packages. θJA is determined according to

JEDEC JESD51-9 on a 4-layer PCB with natural convection

cooling.

Table 5. Thermal Resistance

Package Type

PCB

θJA

Unit

9-Ball, 1.2 mm × 1.2 mm WLCSP

2S0P

88

°C/W

ESD CAUTION