21

The above profile is based on Alpha CVP–390 solder paste, which has been successfully tested with our devices.

Table 17 – Soldering profile temperatures

Stage

Duration/Rate

Temperature

Ramp to soak

2°C/s

Ambient – 185°C

Soak

60s

185°C

Ramp to peak

1°C/s

240°C

Reflow

45s

>225°C

Cool down

2°C/s

18.0 Soldering Profile

18.1

With headers

This device is not recommended for reflow soldering.

The plastic of the pin headers will melt, instead please

hand solder the module or use sockets.

18.2

Without headers

Figure 9 – Reflow soldering temperature profile