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AP3415AI Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS |
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AP3415AI Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS |
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2 / 7 page ![]() AP3415AI -20V P-Channel Enhancement Mode MOSFET AP3415AI Rve:1.2 臺灣永源微電子科技有限公司 Electrical Characterizes @TA=25℃ unless otherwise specified Symbol Parameter Conditions Min. Typ. Max. Units V(BR)DSS Drain-to-Source breakdown voltage VGS = 0V, ID = -250μA -20 — — V RDS(on) Static Drain-to-Source on-resistance VGS=-4.5V,ID = -4A — 37 43 mΩ VGS=-2.5V,ID = -4A — 45 54 VGS=-1.8V,ID = -2A — 56 73 VGS(th) Gate threshold voltage VDS = VGS, ID = -250μA -0.3 — -1.0 V TJ = 125°C — -0.44 — IDSS Drain-to-Source leakage current VDS = -16V,VGS = 0V — — -1 μA TJ = 125°C — — -50 IGSS Gate-to-Source forward leakage VGS =8V — — 10 μA VGS = -8V — — -10 Qg Total gate charge ID = -4A, VDS=-10V, VGS = -4.5V — 10 — nC Qgs Gate-to-Source charge — 0.77 — Qgd Gate-to-Drain("Miller") charge — 3.5 — td(on) Turn-on delay time VGS=-4.5V, VDS =-10V, RGEN=3Ω, — 10 — ns tr Rise time — 8.6 — td(off) Turn-Off delay time — 29 — tf Fall time — 13 — Ciss Input capacitance VGS = 0V, VDS =-10V, ƒ = 1MHz — 939 — pF Coss Output capacitance — 130 — Crss Reverse transfer capacitance — 111 — Source-Drain Ratings and Characteristics Symbol Parameter Conditions Min. Typ. Max. Units IS Continuous Source Current (Body Diode) MOSFET symbol showing the integral reverse p-n junction diode. — — -4.2A ① A ISM Pulsed Source Current (Body Diode) — — -30 A VSD Diode Forward Voltage IS=1A, VGS=0V — -0.76 -1.0 V trr Reverse Recovery Time TJ = 25°C, IF =-4A, di/dt = 100A/μs — 8.7 — ns Qrr Reverse Recovery Charge — 2.3 — nC Notes: ①Calculated continuous current based on maximum allowable junction temperature. ②Repetitive rating; pulse width limited by max. junction temperature. ③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal resistance. ④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C |
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