Reverse Voltage: 40V

Forward Current: 1A

RoHS Device

Comchip Technology CO., LTD.

SMD Schottky Barrier Rectifiers

Halogen Free

REV:A

Page 1

AQW-JB052

ASS14HS-HF

Features

- AEC-Q101 Qualified.

- Ideal for automated placement.

- High forward surge capability.

Circuit Diagram

Cathode 1

2 Anode

Mechanical data

- Case: SOD-323HE, molded plastic.

- Terminals: Tin plated leads, solderable per

J-STD-002 and JESD22-B102.

- Polarity: Cathode line denotes the cathode end.

- Mounting position: Any.

- Low forward voltage drop.

- Low power losses, high efficiency.

Dimensions in inches and (millimeter)

SOD-323HE

0.039(1.00)

0.035(0.90)

0.030(0.75)

0.022(0.55)

0.039(0.98)

0.031(0.78)

0.011(0.27)

0.005(0.12)

0.055(1.40)

0.047(1.20)

0.091(2.30)

0.083(2.10)

0.106(2.70)

0.091(2.30)

0.059(1.50)

0.043(1.10)

0.030(0.75)

0.022(0.55)

Maximum Ratings (at TJ=25°C, unless otherwise noted)

Parameter

Unit

Peak repetitive reverse voltage

Maximum DC blocking voltage

Maximum average forward rectified current at TL (Fig.1)

Symbol

VRRM

VDC

IFSM

V

V

A

A

Value

Maximum RMS reverse voltage

VRMS

V

IO

Peak forward surge current, 8.3ms single half sine-wave

40

28

40

1

30

Voltage rate of change (rated VR)

dV/dt

10000

V/µs

Operating junction temperature range

TJ

°C

Storage temperature range

TSTG

°C

-55 to +150

-55 to +150

Notes: 1. Thermal resistance between junction and ambient and between junction and lead mounted on P.C.B without copper pad areas.

3. Thermal resistance between junction and lead mounted on P.C.B with 6mm x 6mm copper pad areas.

Unit

Parameter

Symbol

Value

RθJL

Thermal resistance

°C/W

RθJL

RθJA

260

65

30

(Note 1)

(Note 1)

(Note 3)

Thermal resistance

Thermal resistance

Thermal Characteristics (at TA=25°C, unless otherwise noted)

1

2

RθJ-SP

10

(Note 2)

Thermal resistance

2. Thermal resistance between junction and cathode tab solder point.