ICS524

LOW SKEW 1 TO 4 CLOCK BUFFER

FAN OUT BUFFER

IDT™ / ICS™ LOW SKEW 1 TO 4 CLOCK BUFFER

5

ICS524

REV C 021909

AC Electrical Characteristics

VDD = 2.5 V ±5%, Ambient Temperature -40 to +85

° C, unless stated otherwise

VDD = 3.3 V ±5%, Ambient Temperature -40 to +85

° C, unless stated otherwise

VDD = 5 V ±5%, Ambient Temperature -40 to +85

° C, unless stated otherwise

Notes: 1. With rail to rail input clock

2. Between any 2 outputs with equal loading.

3. Duty cycle on outputs will match incoming clock duty cycle. Consult IDT for tight duty cycle clock

generators.

Thermal Characteristics

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Input Frequency

0

200

MHz

Output Rise Time

tOR

0.8 to 2.0 V, CL=15 pF

1.0

1.5

ns

Output Fall Time

tOF

2.0 to 0.8 V, CL=15 pF

1.0

1.5

ns

Propagation Delay

Note 1

2.2

3

5

ns

Output to Output Skew

Note 2

Rising edges at VDD/2

0

50

ps

Device to Device Skew

Rising edges at VDD/2

500

ps

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Input Frequency

0

200

MHz

Output Rise Time

tOR

0.8 to 2.0 V, CL=15 pF

0.6

1.0

ns

Output Fall Time

tOF

2.0 to 0.8 V, CL=15 pF

0.6

1.0

ns

Propagation Delay

Note 1

2.0

2.4

4

ns

Output to Output Skew

Note 2

Rising edges at VDD/2

0

50

ps

Device to Device Skew

Rising edges at VDD/2

500

ps

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Input Frequency

0

200

MHz

Output Rise Time

tOR

0.8 to 2.0 V, CL=15 pF

0.3

0.7

ns

Output Fall Time

tOF

2.0 to 0.8 V, CL=15 pF

0.3

0.7

ns

Propagation Delay

Note 1

1.8

2.5

4

ns

Output to Output Skew

Note 2

Rising edges at VDD/2

0

50

ps

Device to Device Skew

Rising edges at VDD/2

500

ps

Parameter

Symbol

Conditions

Min.

Typ.

Max.

Units

Thermal Resistance Junction to

Ambient

θJA

Still air

150

° C/W

θJA

1 m/s air flow

140

° C/W

θJA

3 m/s air flow

120

° C/W

Thermal Resistance Junction to Case

θJC

40

° C/W