Mounting guidelines

1

Soldering

1.1

Solderability of leads

The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1.

Before a solderability test is carried out, terminals are subjected to accelerated ageing (to

IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155

°C). Since the ageing temperature

is far higher than the upper category temperature of the capacitors, the terminal wires should be

cut off from the capacitor before the ageing procedure to prevent the solderability being impaired

by the products of any capacitor decomposition that might occur.

Solder bath temperature

235

±5 °C

Soldering time

2.0

±0.5 s

Immersion depth

2.0 +0/ 0.5 mm from capacitor body or seating plane

Evaluation criteria:

Visual inspection

Wetting of wire surface by new solder

≥90%,

free-flowing solder

1.2

Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20:2008, test Tb, method 1.

Conditions:

Series

Solder bath temperature Soldering time

MKT boxed (except 2.5

× 6.5 × 7.2 mm)

coated

uncoated (lead spacing >10 mm)

260

±5 °C

10

±1s

MFP

MKP (lead spacing >7.5 mm)

MKT boxed (case 2.5

× 6.5 × 7.2 mm)

5

±1s

MKP

MKT

(lead spacing

≤7.5 mm)

uncoated (lead spacing

≤10 mm)

insulated (B32559)

<4 s

recommended soldering

profile for MKT uncoated

(lead spacing

≤ 10 mm) and

insulated (B32559)

B32021 ... B32026

Y2/300VAC

Page 11 of 23

Please read Cautions and warnings and

Important notes at the end of this document.