2020.05.06

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GPIOs available, requiring only 10 external passive components (inc. two crystal load

capacitors). nRF52805 offers the rare combination of low cost and small size, normally

being a trade-off.

The nRF52805 is supported by two Bluetooth Low Energy protocol stacks, SoftDevice

S112 and S113. The S112 and S113 are memory-optimized Peripheral-only stacks supporting

up to 4 connections as a Peripheral concurrently with a Broadcaster. They are Bluetooth

5.1 qualified and supports the following Bluetooth features: high-throughput 2 Mbps and

channel selection algorithm 2 (CSA #2).

The nRF52 DK is the recommended development kit, it emulates the nRF52805, and can

be used as a starting point for development before moving over to a custom board. A

guide on how to use nRF52805 with nRF5 SDK is available.

The nRF52805 SoC is in mass production now, in a 2.48x2.46 WLCSP28 package with 10

GPIOs.

KEY FEATURES

• 64 MHz Arm® Cortex-M4

• 192 KB Flash + 24 KB RAM

• Bluetooth Low Energy

o Bluetooth 5.2

o High-throughput 2 Mbps

o Channel selection algorithm #2

• 2.4 GHz proprietary protocol support

• Ultra-low-power 2.4 GHz multiprotocol radio

o +4 dBm TX power

o -97 dBm RX sensitivity

o 7 mA in TX (4 dBm)

o 4.6 mA in TX (0 dBm)

o 4.6 mA in RX (1 Mbps)

o Integrated balun with single-ended output

• SPI, TWI UART

• 2-channel 12-bit ADC

• Integrated DC/DC regulator

• 0.3

µA in System OFF

• 1.1

µA in System ON with 24 KB RAM retained and RTC running

• Optimized for small two-layer PCB designs

o 2.48x2.46 mm WLCSP package

o Significantly lower cost than four-layer PCB designs

o Only 10 external passive components (inc. two crystal load capacitors)

o 9.5x8.8 mm reference layout is available, giving access to all GPIOs