© 2006 CTS Corporation. All rights reserved. Information subject to change.

CTS Electronic Components

Page 2

March 06

www.ctscorp.com

Memory & IDE Terminator

Complete ClearONE Product, Processing, and Application Information can be found at the following link:

http://www.ctscorp.com/components/clearone.asp

Top Side Probe-able Information

Solder Mask Dia = Pad

Diameter +.15mm(.006 inch)

BGA Routing Scheme

.005 Inch

Wide Traces

Top Side Probe-able Probe

Pad 4x8 Array Shown

Refer to Top Probe-able

Application Notes for additional

information.

Note: Add a ‘P’ suffix to order Top Side Probe-able version.

Example: RT2203B7PTR7.

Refer to the following link for detailed Top Side Probe-able Information:

www.ctscorp.com/components/clearone/TopProveClearOne.pdf

Recommended Land Pattern

1.00mm Pitch (B7) = 0.51mm/.020 inch (minimum)

1.27mm pitch (B6) = 0.64mm/.025 inch (minimum)

Outline of Substrate

PCB Pad Diameter

For .006" Thick Solder Paste Stencil, Aperture Opening Should

be Equal to the PCB Pad Diameter.

additional PCB design information

Mechanical Diagram

K

P (Pitch)

L

W

H

P (Pitch)

A1 Identifier

RT_2__B7

CTS YRWK

D

16 Bit

L

W

H

P

D

K

mm

8.00

±0.15

4.00

±0.15 1.19±0.15 1.00±0.25 0.64±0.05 0.50±0.25

Style C

inch

.315

±.006

.157

±.006 .047±.006 .039±.010 .025±.002 .020±.010

32 Bit

L

W

H

P

D

K

mm

16.00

±0.15 4.00±0.15 1.19±0.15 1.00±0.25 0.64±0.05 0.50±0.25

Style C

inch

.630

±.006

.157

±.006 .047±.006 .039±.010 .025±.002 .020±.010