Package mechanical data

BD442

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in

ECOPACK® packages. These packages have a lead-free second level

interconnect. The category of second level interconnect is marked on the package

and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box

label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com