STTH6002C

Package information

7/9

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 6.

TOP3I dimensions

REF

DIMENSIONS

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.4

4.6

0.173

0.181

B

1.45

1.55

0.057

0.061

C

14.35

15.60

0.565

0.614

D

0.5

0.7

0.020

0.028

E

2.7

2.9

0.106

0.114

F

15.8

16.5

0.622

0.650

G

20.4

21.1

0.815

0.831

H

15.1

15.5

0.594

0.610

J

5.4

5.65

0.213

0.222

K

3.4

3.65

0.134

0.144

ØL

4.08

4.17

0.161

0.164

P

1.20

1.40

0.047

0.055

R

4.60 Typ.

0.181 Typ.

R

H

K

G

F

E

D

B

A

C

JJ

P

ØL