Application information

GS-R24FP

10/15

4.9

Soldering

Soldering phase has to be execute with care : in order to avoid undesired melting

phenomenon, particular attention has to be take on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on

IPC/JEDEC J-STD-020C ,July 2004 recommendations.

Figure 3.

Soldering

Table 7.

Soldering

Profile feature

PB free assembly

3 °C / sec max

Preheat:

150 °C

200 °C

60 – 100 sec

Time maintained above :

217 °C

40 – 70 sec

240 + 0 °C

10 – 20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max